AC'97 |
AC'97 v2.2 specification 详细规格 |
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AGP 3.3V Accelerated Graphics Port Specification 2.0 详细规格 |
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AGP PRO Accelerated Graphics Port PRO Specification 1.01 详细规格 |
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AGP Accelerated Graphics Port Specification 2.0 详细规格 |
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AMR Audio/Modem Riser |
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AX078 |
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AX14 |
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BGA Ball Grid Array |
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BQFP132 |
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EBGA 680L
详细规格 |
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LBGA 160L
详细规格 |
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PBGA 217L Plastic Ball Grid Array 详细规格 |
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SBGA 192L
详细规格 |
TEPBGA 288L |
TEPBGA 288L
详细规格 |
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TSBGA 680L
详细规格 |
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C-Bend Lead |
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CERQUAD Ceramic Quad Flat Pack 详细规格 |
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CLCC
详细规格 |
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CNR Communication and Networking Riser Specification Revision 1.2 详细规格 |
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CPGA Ceramic Pin Grid Array |
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Ceramic Case |
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LAMINATE CSP 112L Chip Scale Package 详细规格 |
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DIMM 168
详细规格 |
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DIMM DDR
详细规格 |
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DIMM168 Dual In-line Memory Module 详细规格 |
DIMM168 |
DIMM168 Pinout 详细规格 |
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DIMM184 For DDR SDRAM Dual In-line Memory Module 详细规格 |
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DIP Dual Inline Package 详细规格 |
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DIP-tab Dual Inline Package with Metal Heatsink |
EIA |
EIA JEDEC formulated EIA Standards |
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EISA Extended ISA 详细规格 |